The adhesion/corrosion balance of the previous study yielded significant new insights into resin design. Polymers with good wet adhesion and good corrosion resistance could be isolated, and those properties correlated back to their monomer compositions and particle morphologies.
Semiconductor packaging assemblies require immense durability to protect the finished device from heat, physical impact, warping, static electricity and moisture. Therefore, formulators of epoxy compounds for semiconductor packaging assemblies require epoxy resins that deliver multiple performance characteristics that are dependent upon the requirements of the application or location of the finished device.
The present study shows that the reactive diluent Tolonate X FLO 100, used in blend with conventional HDI-based polyisocyanates, can bring significant advantages to 2K polyaspartic systems.
The metal packaging industry demands a high-performing coating with a food safety profile desirable to consumers, which not only avoids BPA, but also other materials of concern such as epoxy, styrene or phenolic crosslinkers.
Adding formaldehyde-free alternatives to the encapsulation arsenal will be beneficial for many manufacturers, especially those creating products used directly by consumers or in building materials used in residential or office buildings.
The ability of a formulator to achieve higher-solids automotive coatings provides OEMs a durable, sustainable coatings solution to help capture productivity benefits without sacrificing performance relative to traditional automotive coatings systems.
This article details a statistical design experiment that was commissioned to explore in more detail the roles and effectiveness of varying parameters (raw materials, PVC, types of steel, etc.) in producing intumescent paints.
Waterborne OMU has all the advantages of solventborne OMU including inherent mar resistance, chemical resistance and amber film color, while overcoming the shortcomings of low-VOC solventborne OMU including slow dry and softer film.