Articles Tagged with ''Microencapsulation''

As the coatings industry continues to prioritize waterborne systems, further research to provide coatings with comparable properties to those based on solvent-based systems is required. This paper, winner of the PCI Award for Technical Excellence at the 2023 Waterborne Symposium, presents a surfactant-free encapsulation process that enables the enclosure of polysiloxanes of arbitrary molecular weight in capsules of nanometer size in a simple, scalable process. 

Adding formaldehyde-free alternatives to the encapsulation arsenal will be beneficial for many manufacturers, especially those creating products used directly by consumers or in building materials used in residential or office buildings.

This article reports on our evaluation of AMPARMOR™ 2000, an additive designed to impart self-healing functionality to fusion-bonded epoxy (FBE) and epoxy powder primer coatings, and AMPARMOR 3000, designed as an option for nonepoxy coatings.

Advances in microencapsulation have enabled development of smart coatings that can heal themselves if damaged.