The Technical Conference at SUR/FIN 2008, which will take place at the Indiana Convention Center in Indianapolis, will begin on Monday, June 16, from 2 to 5 p.m., with a program dedicated to innovations in electroless nickel. Track I of the program will launch with “Corrosion Resistance of ELV-Compliant Mid- and Low/Mid-Phosphorous Electroless Nickel,” authored by Nicole Micyus, MacDermid, Inc.
The Technical Conference at SUR/FIN 2008, which will take place at the Indiana Convention Center in Indianapolis, will begin on Monday, June 16, from 2 to 5 p.m., with a program dedicated to innovations in electroless nickel.
Track I of the program will launch with “Corrosion Resistance of ELV-Compliant Mid- and Low/Mid-Phosphorous Electroless Nickel,” authored by Nicole Micyus, MacDermid, Inc. Micyus will discuss how mid- and low/mid-phosphorus electroless nickel (EN) deposits exhibit good resistance to corrosive media. Due to regulations in recent years (i.e., ELV, WEEE, RoHS), many new mid- and low/mid-phosphorus EN processes have been introduced using alternative stabilizers in order to comply. Electrochemical testing was used to compare conventional and ELV-compliant mid- and low/mid-phosphorus deposits in acidic and neutral solutions, and results were compared to the corrosion resistance of high-phosphorus EN. Micyus also will discuss how differences in corrosion resistance due to bath age and deposit thickness were investigated.
In “Operational Experience Using an Organically Stabilized Electroless Nickel,” Duncan Beckett, MacDermid, Inc., will focus on electroless nickel deposits that historically have used heavy metals as stabilizers and brighteners to give bright and easy-to-use processes. This paper will review the experiences gained in using an organically stabilized bath for customers with a range of production environments. The properties compared will include plating speed, brightness, phosphorus content, stability, and activation on a range of substrates while seeking to compare these to other, traditional processes. It will also assess the performance of the deposit in tests such as electrochemical and salt spray corrosion, hardness, and wear.
“A Revolutionary Electroless Nickel-PTFE Plating Process,” by Michael Feldstein and Thomas Lancsek, Surface Technology, Inc., will present information on an electroless nickel-PTFE composite plating process considered to be a quantum leap in plating rate, process, quality and environmental properties. Composite electroless nickel is a widely accepted and growing segment of the plating industry. The inclusion of particulate matter within electroless nickel deposits can be a powerful enhancement of the coating’s inherent characteristics and, in many instances, adds entirely new properties to the plated layer. PTFE is one of the most commonly used materials in such plating due to its exceptional low-friction and release properties. However, there are many drawbacks to current commercial EN-PTFE plating bath systems. This paper will demonstrates a new system that offers advantages over the existing state-of-the-art.
In “Electrodeposited Nickel Phosphorous,” Darell Engelhaupt, University of Alabama in Huntsville, will discuss how modern nickel phosphorus (NiP) electroplating developments have improved the environmental impact and ability to plate any desired thickness with exceptional properties suitable for optical component fabrication.
Finally, in “Low Metal Operation (LMO) for Electroless Nickel Processes,” John Szcypka, MacDermid, Inc., will cover the operating parameters, deposit properties, and cost savings that result from this proven, innovative process. The paper also will present actual data that has been collected for more than five years from Tawas Plating and Powder Coating.
SUR/FIN 2008 is sponsored by the National Association for Surface Finishing (www.nasf.org). For more information, call Cheryl Clark at 202.457.8404, e-mailcclark@nasf.org, or visitwww.sur-fin.net.
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